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Layout   printable version      Also in UnivIS   course list lecture directory     events calendar job offers furniture and equipment offers	Departments >> Faculty of Engineering >> Department of Computer Science >> Chair of Computer Science 3 (Hardware Architectures) >> RTG 1773 - Project A1: 3D-processor architectures for intelligent optical sensor and x-ray sensor fields using innovative technologies Bildverarbeitende Algorithmen arbeiten häufig Daten-parallel, während optische Sensoren trotz paralleler Bildaufnahme Zeilen- bzw. Pixel-seriell ausgelesen werden. In diesem Teilprojekt soll untersucht werden, wie der dadurch entstehende Flaschenhals durch parallelverarbeitende 3D-Prozessor-/Speicherarchitekturen unter Nutzung von 3D-Chipstapeltechniken in zukünftigen eingebetteten intelligenten Sensoren überwunden werden kann. Project manager: Prof. Dr.-Ing. Dietmar Fey Project participants: Benjamin Pfundt, M. Sc., Konrad Häublein, M.Eng., Dr.-Ing. Marc Reichenbach, Akad. Rat Duration: 1.10.2013 - 30.3.2017 Sponsored by: Deutsche Forschungsgemeinschaft Mitwirkende Institutionen: Lehrstuhl für Informatik 3 UnivIS is a product of Config eG, Buckenhof