Öchsner, Richard ; Frickinger, Jürgen ; Pfeffer, Markus ; Schellenberger, Martin ; Roeder, Georg ; Pfitzner, Lothar ; Ryssel, Heiner ; Frizsche, M. ; Kaushik, V. ; Renaud, D. ; Danel, A. ; Claeys, C. ; Bearda, T. ; Lering, M. ; Graef, M. ; Murphy, B. ; Walther, H. ; Hury, S.:
Approach for a Standardized Methodology for Multi-site Processing of 300mm Wafers at R&D-Sites.
In: IEEE (Veranst.):
Proceedings of the International Symposium on Semiconductor Manufacturing (ISSM)
(International Symposium on Semiconductor Manufacturing, Tokyo, -).
2006.
Institution: Lehrstuhl für Elektronische Bauelemente
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